Wafer Debonding Agent and CMP Backside Protective Adhesive

New chip material products—wafer debonding agents and CMP backside protection coatings—are designed to enhance the efficiency of wafer debonding for refurbished wafer manufacturers, reduce interference from residual films on subsequent process steps, and simultaneously lower the chip damage rate during the CMP stage.

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Cutting fluid additives and laser cutting protective tape

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Application scenarios for NMP recovery and recycling

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